Example of Reflow Soldering Condition
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Double heating method with infrared heater.
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2. Temperature measurement:
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Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at solder joints (copper foil surface). A heat resisting tape should be used to fix thermocouple.
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A | B | C | D | E | F | G | H | I | No. of reflows | 250℃ | 230℃ | 150℃ | 150℃ | - | 2 min. | - | 30s | - | 1 time |
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(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
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(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
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Reference for Hand Soldering
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Tip temperature | 350±5℃ | Soldering time | 3s max. | No. of solders | 1 time |
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