Example of Reflow Soldering Condition
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Double heating method with infrared heater.
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2. Temperature measurement
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Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement.
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A | B | C | D | E | F | G | H | No. of reflows | 260℃ | 230℃ | 180℃ | 150℃ | 2 min.max. | 3s | 40s | 4 min.max. | 2 time max. |
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(1)When using an infrared reflow oven, solder may sometimes not be applied. Be sure to use a hot air reflow oven or a type that uses infrared rays in combination with hot air.
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(2)The temperatures given above are the maximum temperatures at the terminals of the potentiometer when employing a hot air reflow method. The temperature of the PC board and the surface temperature of the potentiometer may vary greatly depending on the PC board material, its size and thickness. Ensure that the surface temperature of the potentiometer does not rise to 250°C or greater.
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(3)Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.
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Reference for Hand Soldering
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Tip temperature | 350±10℃ max. | Soldering time | 3(+1, 0)s | No. of solders | 2 time |
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