Waterproofing Using a TACT Switch™ Compatible with Resin Potting
In some TACT Switch™ models, dust and water resistance of contacts is enhanced by covering them with insulators or spacers to improve sealing performance. Even then, however, it is not possible to completely prevent infiltration through the terminal end. The same applies to mounted parts other than TACT Switch™, too. One method of preventing infiltration is to encapsulate each printed circuit board with resin (a process known as resin potting).
Issue with Existing TACT Switch™ Products
While in some TACT Switch™ products, contacts are covered with insulators or spacers to enhance dust and water resistance, there is no way to completely prevent infiltration through the terminal end.
Solution Case Example
To enhance water resistance, the PC board needed to undergo resin potting. Though with normal TACT Switch™ models, the operating part would become submerged in resin. Instead, resin potting was enabled using Alps Alpine potting-compatible type TACT Switch™ models.
Solution Benefits
- Improved sealing performance
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Dust and water resistance of PC boards mounted with TACT Switch™ products can be achieved.
