Part number

SRBE110301

Encoder and Push Operation Type SRBE Series
MEMBERS ONLY
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Basic information

Product Photo
Product Photo
Number of operating shafts
Single-shaft
Shaft material
Resin
Number of detent
12
Number of pulse
6
Operating direction
Horizontal
Mounting method
Standard
Travel (Push operation)
0.2mm
Dimensions (W×D×H)
8.05×11×2.35mm

Specifications

Operating temperature range
-10℃ to +60℃
Ratings (max.)/(min.) (Resistive load)
1mA 5V DC/50μA 3V DC
Electrical performance
Output voltage
1V max. at 1mA 5V DC (Resistive load)
Insulation resistance
10MΩ min. 50V DC
Voltage proof
50V AC for 1 minute
Mechanical performance
Push operating force
3.5±1.5N
Encoders detent torque
3±2m N·m
Actuator strength
Push/pull directions
50N
Durability
Operating life
Center push
100,000 cycles
Encoder
100,000 cycles
Environmental performance
Cold
-30℃ 96h
Dry heat
85℃ 96h
Damp heat
40℃, 90 to 95%RH 96h
Minimum order unit(pcs.)
Japan
1,500
Export
6,000

Land Dimensions

Open an expandable image in a separate window

Viewed from direction A in the dimensions.

Packing Specifications

Taping

Number of packages (pcs.)
1 reel
1,500
1 case / Japan
3,000
1 case / export packing
6,000
Tape width (mm)
24
Export package measurements (mm)
428×413×172

Soldering Condition

Example of Reflow Soldering Condition
  1. Heating method:
    Double heating method with infrared heater.
  2. Temperature measurement:
    Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at solder joints (copper foil surface). A heat resisting tape should be used to fix thermocouple.
  3. Temperature profile

A B C D E F G H I No. of reflows
260℃ 230℃ 180℃ 150℃ 2 min. - - 40s - 1 time

(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board’s temperature greatly differs from that of the switch, depending on the PC board’s material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.

Reference for Hand Soldering
Tip temperature
350±5℃
Soldering time
3s max.
No. of solders
1 time

Notes are common to this series/models

  1. This site catalog shows only outline specifications. When using the products, please obtain formal specifications for supply.
  2. Please place purchase orders for taping products per minimum order unit (1 reel or a case).

Cautions

  1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation.
  2. Avoid use of water-soluble soldering flux, since it may corrode the switches.
  3. Check and conform to soldering requirements under actual mass production conditions.
  4. In soldering twice, make sure the solder joints should go down to normal temperature. Continuing heating will cause deformation of switch, loose and fracfored terminals, or may deteriorate electrical characteristics.
  5. Flux from around and above the PC board should not adhere to the switches.
  6. For the sizes of holes and patterns on a PC board for mounting a switch, refer to the recommended dimensions in the outline drawings.
  7. This switch is designed for manually operated units. Must not use this switch for a mechanical detection unit. For detection purposes, please use our detection switches.
  8. After mounting the switches, if you intend to put the board into an oven in order to harden adhesive for other parts, please consult with ALPS.
  9. Use of a through-hole PC board, or a PC board of different thickness from the recommendation will have a different heat stress. Verify the soldering requirements thoroughly before use.
  10. Solder the switches with detent at the detent position. Soldering switches fixed at the center of the detent may deform the detent mechanisms.
  11. No washing.
  12. Protect small and thin switches from external forces in the set mounting process.
  13. Use of the switches with voltage below 1V DC or current below 10μA may make contacts unstable.
    When using these switches in this way, please consult with us beforehand.
  14. The products are designed and manufactured for direct current resistance. Contact us
    for use of other resistances such as inductive (L) or capacitive (C).
  15. The switch will be broken if impact force or a greater stress than that specified is applied. Take a great care not to let the switch be subject to greater stress than specified.
  16. Do not apply a force from the side of the stem.
  17. Be sure to push the center of switch for "without-stem"type. Extreme care is required for a hinge structure type because the stem press position moves when it is pressed.
  18. Insert these switches to the specified mounting surface and mount them horizontally. If not mounted horizontally, these switches will malfunction.
  19. Use of the switches in a dusty environment may lead the dusts entering through the openings and cause imperfect contact or malfunction. Take this into account for set design.
  20. Corrosive gas if generated by peripheral parts of a set, malfunction such as imperfect contact may occur. Thorough investigation shall be required beforehand.
  21. Be aware of dust intrusion into a non dust-proof-type TACT Switch™.
  22. Storage
    1. Store the products as delivered, at a normal temperature and humidity, without direct sunshine and corrosive gas ambient. Use them at an earliest possible timing, not later than six months upon receipt.
    2. Store the key switches with the switch in the released position.
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